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Electronic Packaging 2026-04-25

Heat Dissipation Substrate

Manufacturing case for heat dissipation substrates.

Heat Dissipation Substrate

Manufacturing case for heat dissipation substrates.

Heat Dissipation Substrate

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Electronic Packaging

Vehicle Microwave Chip Substrate

Manufacturing case for vehicle microwave chip substrates.

Electronic Packaging

Communication Cavity

Manufacturing case for communication cavity components.

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Henan Hanyin Optoelectronic Technology Co., Ltd.

Address: 3F, Building 8, Optoelectronic New Materials Industrial Park, Jingwu Road, Baisha Town, Yichuan County, Luoyang, Henan, China

Email: hanyinguangdian@126.com

Hotline: 0379-62221168 / 17613982566

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